Engineer, DPA (Destructive Physical Analysis) | EAG Laboratories

The DPA Engineer leads and performs advanced analysis of failed semiconductor, LED, solar die-level, or packaged electrical parts. This role requires a strong engineering background, hands-on expertise in destructive and non-destructive techniques, and the ability to innovate and improve processes.Essential Job Functions:Lead Destructive Physical Analysis (DPA) investigations per MIL-STD methods (e.g., MIL-STD-883, MIL-STD-750, MIL-STD-1580) to identify defects and assess reliability risks.Perform advanced failure analysis using optical/digital microscopy, SEM/EDS, X-ray (2D/real-time), and C-SAM to characterize component construction and detect anomalies.Conduct cross-sectioning, de-lidding, chemical/plasma etching, hermeticity testing, and other physical analysis techniques.Design and implement test plans for reliability assessments and root cause investigations in collaboration with multidisciplinary teams.Develop and standardize new techniques (e.g. microwave-induced plasma etching) and bring new tools online to enhance lab capabilities.Analyze sub-micron level features to identify failure initiation sites and construction anomalies.Generate detailed technical reports and present findings to internal teams and customers.Ensure compliance with industry standards (ISO, JEDEC, AEC, IPC) and customer specifications.Provide technical guidance to technicians and junior engineers; mentor team members on best practices.Maintain adherence to safety protocols, Technology Control Plan, and quality system requirements.Protect confidential information and proprietary processes.Work Schedule: Mondays to Fridays: 8am-5pm (flexible)